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  october 2007 rev 1 1/18 18 STGB8NC60KD - stgd8nc60kd stgp8nc60kd n-channel 600v - 8a - d 2 pak / dpak / to-220 short circuit rated powermesh? igbt features lower on voltage drop (v cesat ) lower c res / c ies ratio (no cross-conduction susceptibility) very soft ultra fast recovery antiparallel diode short circuit withstand time 10s applications high frequency motor controls smps and pfc in both hard switch and resonant topologies motor drivers description using the latest high voltage technology based on a patented strip layout, stmicroelectronics has designed an advanced family of igbts, the powermesh? igbts, with outstanding performances. the suffix ?k? identifies a family optimized for high frequency motor control applications with short ci rcuit withstand capability. figure 1. internal schematic diagram type v ces v ce(sat) typ @25c i c @100c STGB8NC60KD 600v 2.2v 8a stgd8nc60kd 600v 2.2v 8a stgp8nc60kd 600v 2.2v 8a to-220 d 2 pak 1 2 3 1 3 1 3 dpak table 1. device summary order codes marking package packaging STGB8NC60KD gb8nc60kd d2pak tape & reel stgd8nc60kd gd8nc60kd dpak tape & reel stgp8nc60kd gp8nc60kd to-220 tube www.st.com
contents STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 2/18 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd electrical ratings 3/18 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit d2pak/to-220 dpak v ces collector-emitter voltage (v gs = 0) 600 v i c (1) 1. calculated according to the iterative formula: collector current (continuous) at t c = 25c 15 a i c (1) collector current (continuous) at t c = 100c 8a i cp (2) 2. pulse width limited by max junction temperature pulsed collector current 30 a v ge gate-emitter voltage 20 v i f diode rms forward current at tc=25c 7 a i fsm surge not repetitive forward current tp = 10ms sinusoidal 20 a p tot total dissipation at t c = 25c 65 62 w t j operating junction temperature ? 55 to 150 c t scw short circuit withstand time 10 s table 3. thermal resistance symbol parameter value unit rthj-case thermal resistance junction-case max igbt to-220 / d2pak 1.9 c/w dpak 2.0 c/w rthj-case thermal resistance junction-case max diode to-220 / d2pak 4c/w dpak 4.5 c/w rthj-amb thermal resistance junction-ambient max 62.5 c/w i c t c () t jmax t c ? r thj c ? v cesat max () t c i c , () ------------------------------------------------------------------------------------------------------ =
electrical characteristics STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 4/18 2 electrical characteristics (t case =25c unless otherwise specified) table 4. static symbol parameter test conditions min. typ. max. unit v br(ces) collector-emitter breakdown voltage i c = 1ma, v ge = 0 600 v v ce(sat) collector-emitter saturation voltage v ge = 15v, i c =3a v ge = 15v, i c = 3a, tc= 125c 2.2 1.8 2.75 v v v ge(th) gate threshold voltage v ce = v ge , i c = 250 a 4.5 6.5 v i ces collector cut-off current (v ge = 0) v ce = max rating,t c = 25c v ce =max rating,t c = 125c 150 1 a ma i ges gate-emitter leakage current (v ce = 0) v ge = 20v, v ce = 0 100 na g fs forward transconductance v ce = 15v , i c = 3a 15 s table 5. dynamic symbol parameter test conditions min. typ. max. unit c ies c oes c res input capacitance output capacitance reverse transfer capacitance v ce = 25v, f = 1mhz, v ge = 0 380 46 8.5 pf pf pf q g q ge q gc total gate charge gate-emitter charge gate-collector charge v ce = 390v, i c = 3a, v ge = 15v, (see figure 19) 19 5 9 nc nc nc
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd electrical characteristics 5/18 table 6. switching on/off (inductive load) symbol parameter test conditions min. typ. max. unit t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390v, i c = 3a r g = 10 ? , v ge = 15v, tj= 25c (see figure 20) 17 6 655 ns ns a/s t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390v, i c =3a r g = 10 ? , v ge = 15v, tj=125c (see figure 20) 16.5 6.5 575 ns ns a/s t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 390v, i c = 3a, r ge = 10 ? , v ge =15v, t j =25c (see figure 20) 33 72 82 ns ns ns t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 390v, i c = 3a, r ge =10 ? , v ge =15v, tj=125c (see figure 20) 60 106 136 ns ns ns table 7. switching energy (inductive load) symbol parameter test conditions min. typ. max. unit e on (1) e off (2) e ts 1. eon is the turn-on losses when a typi cal diode is used in the test circuit in figure 2. if the igbt is offered in a package with a co-pak diode, the co-pack diode is used as external diode. igbts & diode are at the same temperature (25c and 125c) 2. turn-off losses include also the tail of the collector current turn-on switching losses turn-off switching losses total switching losses v cc = 390v, i c = 3a r g =10 ? , v ge =15v, tj=25c (see figure 20) 55 85 140 j j j e on (1) e off (2) e ts turn-on switching losses turn-off switching losses total switching losses v cc = 390v, i c = 3a r g =10 ? , v ge = 15v, tj= 125c (see figure 20) 87 162 249 j j j
electrical characteristics STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 6/18 table 8. collector-emitter diode symbol parameter test cond itions min. typ. max. unit v f forward on-voltage i f = 3a i f = 3a, tj = 125c 1.6 1.3 2.1 v v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i f = 3a,v r = 30v, tj = 25c, di/dt = 100 a/ s (see figure 21) 23.5 16.5 1.4 ns nc a t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i f = 3a,v r = 30v, tj =125c, di/dt = 100a/ s (see figure 21) 39 39 2 ns nc a
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd electrical characteristics 7/18 2.1 electrical characteris tics (curves) figure 2. output characteristics figure 3. transfer characteristics figure 4. transconductance figure 5. collector-emitter on voltage vs temperature figure 6. gate charge vs gate-source voltage figure 7. capacitance variations
electrical characteristics STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 8/18 figure 8. normalized gate threshold voltage vs temperature figure 9. collector-emitter on voltage vs collector current figure 10. normalized breakdown voltage vs temperature figure 11. switching losses vs temperature figure 12. switching losses vs gate resistance figure 13. switching losses vs collector current
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd electrical characteristics 9/18 figure 14. thermal impedance for to-220/ d2pak figure 15. turn-off soa figure 16. forward voltage drop versus forward current figure 17. thermal impedance for dpak
test circuit STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 10/18 3 test circuit figure 18. test circuit for inductive load switching figure 19. gate charge test circuit figure 20. switching waveform figure 21. diode recovery time waveform
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd package mechanical data 11/18 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
package mechanical data STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 12/18 to-220 mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 b 0.61 0. 88 0.024 0.0 3 4 b 1 1.14 1.70 0.044 0.066 c0.4 9 0.70 0.01 9 0.027 d 15.25 15.75 0.6 0.62 d1 1.27 0.050 e 10 10.40 0. 393 0.40 9 e 2.40 2.70 0.0 9 4 0.106 e1 4. 9 5 5.15 0.1 9 4 0.202 f1.2 3 1. 3 2 0.04 8 0.051 h1 6.20 6.60 0.244 0.256 j1 2.40 2.72 0.0 9 4 0.107 l1 3 14 0.511 0.551 l1 3 .50 3 . 93 0.1 3 7 0.154 l20 16.40 0.645 l 3 02 8 . 9 0 1.1 3 7 ? p 3 .75 3 . 8 5 0.147 0.151 q2.65 2. 9 5 0.104 0.116
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd package mechanical data 13/18 dim. mm. inch min. typ max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 d1 5.1 0.200 e 6.4 6.6 0.252 0.260 e1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l 1 0.039 (l1) 2.8 0.110 l2 0.8 0.031 l4 0.6 1 0.023 0.039 r 0.2 0.008 v2 0 8 0 8 dpak mechanical data 0068772-f
package mechanical data STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 14/18 d2pak mechanical data dim mm inch min typ max min typ max a 4.4 4.6 0.17 3 0.1 8 1 a1 2.4 9 2.6 9 0.0 98 0.106 a2 0.0 3 0.2 3 0.001 0.00 9 b 0.7 0. 93 0.027 0.0 3 6 b2 1.14 1.7 0.044 0.067 c 0.45 0.6 0.017 0.02 3 c2 1.2 3 1. 3 6 0.04 8 0.05 3 d 8 . 9 5 9 . 3 50. 3 52 0. 3 6 8 d1 8 0. 3 15 e 10 10.4 0. 393 0.40 9 e1 8 .5 0. 33 4 g4. 88 5.2 8 0.1 9 20.20 8 l15 15. 8 5 0.5 9 0 0.625 l2 1.27 1.4 0.50 0.55 l 3 1.4 1.75 0.055 0.6 8 m2.4 3 .2 0.0 9 40.126 r 0.4 0.015 v2 0 4
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd packaging mechanical data 15/18 5 packaging mechanical data tape and reel shipment d 2 pak footprint * on sales type dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.039 n 100 3.937 t 30.4 1.197 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.413 0.421 b0 15.7 15.9 0.618 0.626 d 1.5 1.6 0.059 0.063 d1 1.59 1.61 0.062 0.063 e 1.65 1.85 0.065 0.073 f 11.4 11.6 0.449 0.456 k0 4.8 5.0 0.189 0.197 p0 3.9 4.1 0.153 0.161 p1 11.9 12.1 0.468 0.476 p2 1.9 2.1 0.075 0.082 r 50 1.574 t 0.25 0.35 0.0098 0.0137 w 23.7 24.3 0.933 0.956 tape mechanical data
packaging mechanical data STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 16/18 tape and reel shipment dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 2500 2500 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd revision history 17/18 6 revision history table 9. document revision history date revision changes 02-oct-2007 1 first release
STGB8NC60KD - stgd8nc60kd - stgp8nc60kd 18/18 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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